Backplate with SMA ports and a built-in Meshtastic node (CRANK)
A printed rear panel with SMA bulkheads for Wi-Fi, Bluetooth, LoRa, LTE and GNSS, housing a WisBlock LoRa radio, its own LiPo and later a small solar panel.
What it takes
- 3D print
- Disassembly
- Soldering
- Purchase required
Difficulty 3 of 3 — advanced.
Details
CRANK's backpanel started at v0.7 in February 2024 with SMA holes for Bluetooth, Wi-Fi, 915 MHz LoRa, LTE and an optional GNSS port, room for a Rokland WisBlock radio running Meshtastic with its own LiPo, power button and USB extension, and heat pipes for the CM4; by v0.19 a thin solar panel had joined the plate. Funcron warned that heat pipes against a plastic back are risky at the 82 °C the CPU reaches, so CRANK moved to ASA or nylon with a heat-deflection temperature above 105 °C.
The Printables model is the Meshtastic node backplate; a six-cell 18650 version was planned and has its own wiring thread.



